晶圆移载系统（EFEM, Equipment Front End Module）
Category: Smart Manufacturing
Exhibitor: HIWIN TECHNOLOGIES CORP.
Booth No: N/A
Characteristic
HIWIN透过软硬体的垂直整合，打造完整自动化的晶圆移载系统(EFEM)，搭配自行研发之控制系统，能弹性选配Wafer ID读取、晶舟盒RFID感应、晶圆寻边校正、 凸片检知、站点在席感测等周边配件进行规划，满足不同客户的需求。 另可搭载智慧型滚珠螺杆- i4.0BS(Intelligent 4.0 Ballscrew)，即时监控设备状况，提升利用率，使客户的设备和制程更有效率及竞争力。
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i系列智慧型新世代线性传动元件
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