AI automatic optical wafer/wafer defect and height variation inspection equipment

Model: SE-5AT2-100

Booth No: I806

Characteristic

Provides accurate optical inspection and analysis of defects generated in semiconductor wafers during the manufacturing process
→ Use the auto-focusing microscope module with the XYZ three-axis displacement platform (integrated optical scale) to perform fly-by-shot to capture wafer/chip surface images.
→ Carry out image comparison and AI image deep learning method according to the defects that need to be detected to reduce the occurrence of overkill (OVER KILL) and missed detection (UNDER KILL).
→ As a result of AI judgment, the type, coordinates, area, and quantity of defects on the wafer are clear, and the data is perfectly integrated.
→ It can automatically sort OK/NG parts with custom tolerances, calculate the area size, number of defects and mark the position of defects for defects, and can also integrate automation,
Improve detection efficiency.
https://en.buenooptics.com/5at2.html