Exhibitor: JASDI CHEMICALS CO., LTD.
Date: 2025-06-24
Booth No.: S00-13
TIM (Thermal Interface Material)
TIM is primarily used to fill the gaps between two solid surfaces, typically between a heat-generating component (such as a processor or power module) and a cooling device (such as a heat sink or radiator). Since these surfaces are not perfectly flat, tiny air gaps exist that hinder efficient heat transfer.
The main purpose of TIM is to fill these irregular gaps, reducing the presence of low thermal conductivity materials like air, thereby improving heat transfer efficiency. These materials commonly include thermal grease, thermal gel, thermal clay, etc., and offer various physical properties and thermal performance depending on the application.
Jasdi offers a full range of TIM / thermal management materials, including:
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Thermal grease
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Thermal putty
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Thermal gap filler
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Thermal adhesive
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Thermal potting compound
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Thermal gasket
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Thermal pad
If you are interested in our thermal management materials or would like to discuss your specific needs, we would be more than happy to provide professional advice and support.
Please feel free to contact us anytime!
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